Techniques to ensure the design can manufacture successfully with high yield
To ensures survival of the design, during the complex fabrication process
Lithography, etch, Chemical Mechanical Polishing (CMP), and mask systematic manufacturing variations surpass random variations as the prime limiters to catastrophic and parametric yield loss
Need for DFM
Current Lithographic techniques (193nm Laser) cannot print deep-submicron technology patterns without distortion
Higher design complexity and shrinking device geometries
More devices per unit area on a chip (device density)
Importance of DFM
Impact of variations, if not addressed in the design, will cause manufacturing issues, such as poor yields, long yield ramp-up times and poor reliability
The chips may completely miss the market window or may hit the market window but not economically viable
The chips may still function, but not at the required/expected speed
The chips appear to be reliable after volume production, but may suffer catastrophic failures in the field earlier than their expected life-cycle
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